| 图片 | 型号 | 像元数 | 像元尺寸 | 暗电流 | 像元中心距 | 电容 | 封装 | 引脚数 | 封装类型 | 窗口 |
|---|---|---|---|---|---|---|---|---|---|---|
|
FCI-InGaAs-4M | 4*1 | Ø75 μm | 0.03 nA@-5V | 250 μm | 0.65 pF@-5V | Ceramic Submount | Chip | - | |
|
FCI-InGaAs-12M | 12*1 | Ø75 μm | 0.03 nA@-5V | 250 μm | 0.65 pF@-5V | Ceramic Submount | Chip | - | |
|
FCI-InGaAs-8M | 8*1 | Ø75 μm | 0.03 nA@-5V | 250 μm | 0.65 pF@-5V | Ceramic Submount | Chip | - | |
|
FCI-InGaAs-16M | 16*1 | Ø75 μm | 0.03 nA@-5V | 250 μm | 0.65 pF@-5V | Ceramic Submount | Chip | - | |
|
FCI-InGaAs-300B1X4 | 4*1 | Ø300 μm | 0.05 nA@-5V | 500 μm | 8 pF@-5V | Ceramic Submount | Chip | - | |
|
FCI-InGaAs-300B1X8 | 8*1 | Ø300 μm | 0.05 nA@-5V | 500 μm | 8 pF@-5V | Ceramic Submount | Chip | - |